EF-587 Lead and Cadmium Free Mirror Bright Electroless Nickel
It is a medium-phosphorus electroless nickel plating process. When the bath is maintained in a very stable range, a bright nickel-phosphorus alloy can always be deposited at a high deposition rate, which can be directly applied to lead-containing steel and lead-containing brass. , Some copper alloys and medium and low nickel stainless steel sink nickel.
Category:
EF-9 Lead and Cadmium Free Mirror Bright Electroless Nickel
Product Description
It is a medium-phosphorus electroless nickel plating process that, when the bath is maintained within a highly stable range, consistently deposits bright nickel‑phosphorus alloy at very high deposition rates. It can be applied directly to leaded steel, leaded brass, certain copper alloys, and low‑ to medium‑nickel stainless steels.
Tank solution start-up:
Preparation of bath/stock solution: EF-587A 6.0%, EF-587B 15.0%, diluted with deionized water to the operating level.
Bath life: For steel, 8–10 MTO; for aluminum, 5–7 MTO. A cycle is completed by adding 6 g/L of nickel.
Shower Gel Maintenance and Refill Instructions (100 L) (Add at a 1:1 ratio)
Note: Do not exceed a dosage of 20%. If solution losses are significant, add small amounts repeatedly; adding a large quantity at once (>20%) may lead to rapid deposition, localized passivation, or complete cessation of the reaction. Maintain the operating temperature between 85 and 90°C; excessively high temperatures can accelerate plating or cause bath decomposition, while temperatures that are too low may reduce the plating rate. When the process is idle, keeping the solution at the operating temperature for an extended period can result in excessive consumption of hypophosphite and shorten the bath life.
Operating parameters
Deposition rate
Plating bath load:
The plating solution is loaded at 0.49 dm. 2 /L~2.46 0.49dm 2 Between L, overloading leads to a reduced deposition rate, sluggish deposition, and bath instability. Underloading, on the other hand, can result in rapid deposition, localized passivation, or complete surface passivation. If it becomes unavoidable for the bath’s operating volume to fall below the minimum control level, the following remedial measures may be employed:
1) The bath solution’s pH and temperature exceed their maximum values.
2) Maintain the bath solution’s activity (nickel content) at 80%
3) Reduce or remove the solution, and stir with air.
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